Senior Photonics Packaging Engineer

My client is looking for a Senior Photonics Packaging Engineer role, focused on taking photonic integrated circuits from prototype through to manufacturable products. Senior Photonics Packaging Engineer position covering optical, electrical and mechanical integration of advanced PICs.This is an exciting opportunity within a fast-growing photonics company developing next-generation optical interconnect technologies, such as Quantum or AI applications.

Responsibilities Own the packaging of photonic integrated circuits from prototype through to production-ready modules

Develop optical coupling solutions including fibre alignment, attachment and bonding processes

Define and optimise electrical interfaces including DC, RF and high-speed interconnect architectures

Support substrate and interposer selection across silicon, glass, ceramic and organic platforms

Develop scalable assembly and packaging processes suitable for pilot production

Perform optical characterisation, testing and failure analysis of packaged devices

Use experimental results to improve package performance, manufacturability and yield

Work closely with photonics, electronics and R&D teams to ensure packaging requirements are incorporated into product development

Collaborate with external assembly, substrate and foundry partners to deliver packaging solutions

Establish engineering processes, documentation and best practices as the company scales

Requirements 5+ years experience in photonics engineering with strong hands‑on PIC packaging experience

Experience developing photonic packaging solutions from laboratory prototypes towards volume manufacture

Strong understanding of optical coupling, alignment and attachment techniques

Knowledge of photonic assembly processes and packaging technologies

Experience with high‑speed electrical interfaces, RF connectivity or optoelectronic integration

Ability to perform and interpret optical characterisation and validation measurements

Strong problem‑solving skills and understanding of packaging trade‑offs

Ability to work independently within a small, fast‑paced engineering team

Desirable Experience with photonic design or optical modelling tools

Experience with reliability qualification and environmental testing

Experience working with foundries, substrate vendors or assembly partners

Knowledge of advanced packaging technologies, RF packaging or photonic interconnect systems

Startup or scale‑up experience within photonics or semiconductor environments

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